Kconfig 17 KB

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  1. # SPDX-License-Identifier: GPL-2.0-only
  2. #
  3. # Generic thermal drivers configuration
  4. #
  5. menuconfig THERMAL
  6. bool "Thermal drivers"
  7. help
  8. Thermal drivers offer a generic mechanism for
  9. thermal management. Usually it's made up of one or more thermal
  10. zones and cooling devices.
  11. Each thermal zone contains its own temperature, trip points,
  12. and cooling devices.
  13. All platforms with ACPI or Open Firmware thermal support can use
  14. this driver.
  15. If you want this support, you should say Y here.
  16. if THERMAL
  17. config THERMAL_NETLINK
  18. bool "Thermal netlink management"
  19. depends on NET
  20. help
  21. The thermal framework has a netlink interface to do thermal
  22. zones discovery, temperature readings and events such as
  23. trip point crossed, cooling device update or governor
  24. change. It is recommended to enable the feature.
  25. config THERMAL_STATISTICS
  26. bool "Thermal state transition statistics"
  27. help
  28. Export thermal state transition statistics information through sysfs.
  29. If in doubt, say N.
  30. config THERMAL_DEBUGFS
  31. bool "Thermal subsystem debug support"
  32. depends on DEBUG_FS
  33. help
  34. Say Y to allow the thermal subsystem to collect diagnostic
  35. information that can be accessed via debugfs.
  36. config THERMAL_CORE_TESTING
  37. tristate "Thermal core testing facility"
  38. depends on DEBUG_FS
  39. help
  40. Say Y to add a debugfs-based thermal core testing facility.
  41. It allows test thermal zones to be created and populated
  42. with trip points in order to exercise the thermal core
  43. functionality in a controlled way.
  44. config THERMAL_EMERGENCY_POWEROFF_DELAY_MS
  45. int "Emergency poweroff delay in milli-seconds"
  46. default 0
  47. help
  48. Thermal subsystem will issue a graceful shutdown when
  49. critical temperatures are reached using orderly_poweroff(). In
  50. case of failure of an orderly_poweroff(), the thermal emergency
  51. poweroff kicks in after a delay has elapsed and shuts down the system.
  52. This config is number of milliseconds to delay before emergency
  53. poweroff kicks in. Similarly to the critical trip point,
  54. the delay should be carefully profiled so as to give adequate
  55. time for orderly_poweroff() to finish on regular execution.
  56. If set to 0 emergency poweroff will not be supported.
  57. In doubt, leave as 0.
  58. config THERMAL_HWMON
  59. bool
  60. prompt "Expose thermal sensors as hwmon device"
  61. depends on HWMON=y || HWMON=THERMAL
  62. default y
  63. help
  64. In case a sensor is registered with the thermal
  65. framework, this option will also register it
  66. as a hwmon. The sensor will then have the common
  67. hwmon sysfs interface.
  68. Say 'Y' here if you want all thermal sensors to
  69. have hwmon sysfs interface too.
  70. config THERMAL_OF
  71. bool
  72. prompt "APIs to parse thermal data out of device tree"
  73. depends on OF
  74. default y
  75. help
  76. This options provides helpers to add the support to
  77. read and parse thermal data definitions out of the
  78. device tree blob.
  79. Say 'Y' here if you need to build thermal infrastructure
  80. based on device tree.
  81. choice
  82. prompt "Default Thermal governor"
  83. default THERMAL_DEFAULT_GOV_STEP_WISE
  84. help
  85. This option sets which thermal governor shall be loaded at
  86. startup. If in doubt, select 'step_wise'.
  87. config THERMAL_DEFAULT_GOV_STEP_WISE
  88. bool "step_wise"
  89. select THERMAL_GOV_STEP_WISE
  90. help
  91. Use the step_wise governor as default. This throttles the
  92. devices one step at a time.
  93. config THERMAL_DEFAULT_GOV_FAIR_SHARE
  94. bool "fair_share"
  95. select THERMAL_GOV_FAIR_SHARE
  96. help
  97. Use the fair_share governor as default. This throttles the
  98. devices based on their 'contribution' to a zone. The
  99. contribution should be provided through platform data.
  100. config THERMAL_DEFAULT_GOV_USER_SPACE
  101. bool "user_space"
  102. select THERMAL_GOV_USER_SPACE
  103. help
  104. The Userspace governor allows to get trip point crossed
  105. notification from the kernel via uevents. It is recommended
  106. to use the netlink interface instead which gives richer
  107. information about the thermal framework events.
  108. config THERMAL_DEFAULT_GOV_POWER_ALLOCATOR
  109. bool "power_allocator"
  110. depends on THERMAL_GOV_POWER_ALLOCATOR
  111. help
  112. Select this if you want to control temperature based on
  113. system and device power allocation. This governor can only
  114. operate on cooling devices that implement the power API.
  115. config THERMAL_DEFAULT_GOV_BANG_BANG
  116. bool "bang_bang"
  117. depends on THERMAL_GOV_BANG_BANG
  118. help
  119. Use the bang_bang governor as default. This throttles the
  120. devices one step at the time, taking into account the trip
  121. point hysteresis.
  122. endchoice
  123. config THERMAL_GOV_FAIR_SHARE
  124. bool "Fair-share thermal governor"
  125. help
  126. Enable this to manage platform thermals using fair-share governor.
  127. config THERMAL_GOV_STEP_WISE
  128. bool "Step_wise thermal governor"
  129. help
  130. Enable this to manage platform thermals using a simple linear
  131. governor.
  132. config THERMAL_GOV_BANG_BANG
  133. bool "Bang Bang thermal governor"
  134. default n
  135. help
  136. Enable this to manage platform thermals using bang bang governor.
  137. Say 'Y' here if you want to use two point temperature regulation
  138. used for fans without throttling. Some fan drivers depend on this
  139. governor to be enabled (e.g. acerhdf).
  140. config THERMAL_GOV_USER_SPACE
  141. bool "User_space thermal governor"
  142. help
  143. Enable this to let the user space manage the platform thermals.
  144. config THERMAL_GOV_POWER_ALLOCATOR
  145. bool "Power allocator thermal governor"
  146. depends on ENERGY_MODEL
  147. help
  148. Enable this to manage platform thermals by dynamically
  149. allocating and limiting power to devices.
  150. config CPU_THERMAL
  151. bool "Generic cpu cooling support"
  152. depends on THERMAL_OF
  153. help
  154. Enable the CPU cooling features. If the system has no active
  155. cooling device available, this option allows to use the CPU
  156. as a cooling device.
  157. if CPU_THERMAL
  158. config CPU_FREQ_THERMAL
  159. bool "CPU frequency cooling device"
  160. depends on CPU_FREQ
  161. default y
  162. help
  163. This implements the generic cpu cooling mechanism through frequency
  164. reduction. An ACPI version of this already exists
  165. (drivers/acpi/processor_thermal.c).
  166. This will be useful for platforms using the generic thermal interface
  167. and not the ACPI interface.
  168. config CPU_IDLE_THERMAL
  169. bool "CPU idle cooling device"
  170. depends on IDLE_INJECT
  171. help
  172. This implements the CPU cooling mechanism through
  173. idle injection. This will throttle the CPU by injecting
  174. idle cycle.
  175. endif
  176. config DEVFREQ_THERMAL
  177. bool "Generic device cooling support"
  178. depends on PM_DEVFREQ
  179. depends on PM_OPP
  180. help
  181. This implements the generic devfreq cooling mechanism through
  182. frequency reduction for devices using devfreq.
  183. This will throttle the device by limiting the maximum allowed DVFS
  184. frequency corresponding to the cooling level.
  185. In order to use the power extensions of the cooling device,
  186. devfreq should use the simple_ondemand governor.
  187. If you want this support, you should say Y here.
  188. config PCIE_THERMAL
  189. bool "PCIe cooling support"
  190. depends on PCIEPORTBUS
  191. help
  192. This implements PCIe cooling mechanism through bandwidth reduction
  193. for PCIe devices.
  194. If you want this support, you should say Y here.
  195. config THERMAL_EMULATION
  196. bool "Thermal emulation mode support"
  197. help
  198. Enable this option to make a emul_temp sysfs node in thermal zone
  199. directory to support temperature emulation. With emulation sysfs node,
  200. user can manually input temperature and test the different trip
  201. threshold behaviour for simulation purpose.
  202. WARNING: Be careful while enabling this option on production systems,
  203. because userland can easily disable the thermal policy by simply
  204. flooding this sysfs node with low temperature values.
  205. config THERMAL_MMIO
  206. tristate "Generic Thermal MMIO driver"
  207. depends on OF
  208. depends on HAS_IOMEM
  209. help
  210. This option enables the generic thermal MMIO driver that will use
  211. memory-mapped reads to get the temperature. Any HW/System that
  212. allows temperature reading by a single memory-mapped reading, be it
  213. register or shared memory, is a potential candidate to work with this
  214. driver.
  215. config HISI_THERMAL
  216. tristate "Hisilicon thermal driver"
  217. depends on ARCH_HISI || COMPILE_TEST
  218. depends on HAS_IOMEM
  219. depends on OF
  220. default ARCH_HISI
  221. help
  222. Enable this to plug hisilicon's thermal sensor driver into the Linux
  223. thermal framework. cpufreq is used as the cooling device to throttle
  224. CPUs when the passive trip is crossed.
  225. config IMX_THERMAL
  226. tristate "Temperature sensor driver for Freescale i.MX SoCs"
  227. depends on ARCH_MXC || COMPILE_TEST
  228. depends on NVMEM || !NVMEM
  229. depends on MFD_SYSCON
  230. depends on OF
  231. help
  232. Support for Temperature Monitor (TEMPMON) found on Freescale i.MX SoCs.
  233. It supports one critical trip point and one passive trip point. The
  234. cpufreq is used as the cooling device to throttle CPUs when the
  235. passive trip is crossed.
  236. config IMX_SC_THERMAL
  237. tristate "Temperature sensor driver for NXP i.MX SoCs with System Controller"
  238. depends on IMX_SCU
  239. depends on OF
  240. help
  241. Support for Temperature Monitor (TEMPMON) found on NXP i.MX SoCs with
  242. system controller inside, Linux kernel has to communicate with system
  243. controller via MU (message unit) IPC to get temperature from thermal
  244. sensor. It supports one critical trip point and one
  245. passive trip point for each thermal sensor.
  246. config IMX8MM_THERMAL
  247. tristate "Temperature sensor driver for Freescale i.MX8MM SoC"
  248. depends on ARCH_MXC || COMPILE_TEST
  249. depends on OF
  250. help
  251. Support for Thermal Monitoring Unit (TMU) found on Freescale i.MX8MM SoC.
  252. It supports one critical trip point and one passive trip point. The
  253. cpufreq is used as the cooling device to throttle CPUs when the passive
  254. trip is crossed.
  255. config IMX91_THERMAL
  256. tristate "Temperature sensor driver for NXP i.MX91 SoC"
  257. depends on ARCH_MXC || COMPILE_TEST
  258. depends on OF
  259. help
  260. Include one sensor and six comparators. Each of them compares the
  261. temperature value (from the sensor) against the programmable
  262. threshold values. The direction of the comparison is configurable
  263. (greater / lesser than).
  264. config K3_THERMAL
  265. tristate "Texas Instruments K3 thermal support"
  266. depends on ARCH_K3 || COMPILE_TEST
  267. help
  268. If you say yes here you get thermal support for the Texas Instruments
  269. K3 SoC family. The current chip supported is:
  270. - AM654
  271. This includes temperature reading functionality.
  272. config MAX77620_THERMAL
  273. tristate "Temperature sensor driver for Maxim MAX77620 PMIC"
  274. depends on MFD_MAX77620
  275. depends on OF
  276. help
  277. Support for die junction temperature warning alarm for Maxim
  278. Semiconductor PMIC MAX77620 device. Device generates two alarm
  279. interrupts when PMIC die temperature cross the threshold of
  280. 120 degC and 140 degC.
  281. config QORIQ_THERMAL
  282. tristate "QorIQ Thermal Monitoring Unit"
  283. depends on THERMAL_OF && HAS_IOMEM
  284. depends on PPC_E500MC || SOC_LS1021A || ARCH_LAYERSCAPE || (ARCH_MXC && ARM64) || COMPILE_TEST
  285. select REGMAP_MMIO
  286. help
  287. Support for Thermal Monitoring Unit (TMU) found on QorIQ platforms.
  288. It supports one critical trip point and one passive trip point. The
  289. cpufreq is used as the cooling device to throttle CPUs when the
  290. passive trip is crossed.
  291. config AIROHA_THERMAL
  292. tristate "Airoha thermal sensor driver"
  293. depends on ARCH_AIROHA || COMPILE_TEST
  294. depends on MFD_SYSCON
  295. depends on OF
  296. help
  297. Enable this to plug the Airoha thermal sensor driver into the Linux
  298. thermal framework.
  299. config SPEAR_THERMAL
  300. tristate "SPEAr thermal sensor driver"
  301. depends on PLAT_SPEAR || COMPILE_TEST
  302. depends on HAS_IOMEM
  303. depends on OF
  304. help
  305. Enable this to plug the SPEAr thermal sensor driver into the Linux
  306. thermal framework.
  307. config SUN8I_THERMAL
  308. tristate "Allwinner sun8i thermal driver"
  309. depends on ARCH_SUNXI || COMPILE_TEST
  310. depends on HAS_IOMEM
  311. depends on NVMEM
  312. depends on OF
  313. depends on RESET_CONTROLLER
  314. help
  315. Support for the sun8i thermal sensor driver into the Linux thermal
  316. framework.
  317. To compile this driver as a module, choose M here: the
  318. module will be called sun8i-thermal.
  319. config ROCKCHIP_THERMAL
  320. tristate "Rockchip thermal driver"
  321. depends on ARCH_ROCKCHIP || COMPILE_TEST
  322. depends on RESET_CONTROLLER
  323. depends on HAS_IOMEM
  324. help
  325. Rockchip thermal driver provides support for Temperature sensor
  326. ADC (TS-ADC) found on Rockchip SoCs. It supports one critical
  327. trip point. Cpufreq is used as the cooling device and will throttle
  328. CPUs when the Temperature crosses the passive trip point.
  329. config KIRKWOOD_THERMAL
  330. tristate "Temperature sensor on Marvell Kirkwood SoCs"
  331. depends on MACH_KIRKWOOD || COMPILE_TEST
  332. depends on HAS_IOMEM
  333. depends on OF
  334. help
  335. Support for the Kirkwood thermal sensor driver into the Linux thermal
  336. framework. Only kirkwood 88F6282 and 88F6283 have this sensor.
  337. config DOVE_THERMAL
  338. tristate "Temperature sensor on Marvell Dove SoCs"
  339. depends on ARCH_DOVE || MACH_DOVE || COMPILE_TEST
  340. depends on HAS_IOMEM
  341. depends on OF
  342. help
  343. Support for the Dove thermal sensor driver in the Linux thermal
  344. framework.
  345. config DB8500_THERMAL
  346. tristate "DB8500 thermal management"
  347. depends on MFD_DB8500_PRCMU && OF
  348. default y
  349. help
  350. Adds DB8500 thermal management implementation according to the thermal
  351. management framework. A thermal zone with several trip points will be
  352. created. Cooling devices can be bound to the trip points to cool this
  353. thermal zone if trip points reached.
  354. config ARMADA_THERMAL
  355. tristate "Marvell EBU Armada SoCs thermal management"
  356. depends on ARCH_MVEBU || COMPILE_TEST
  357. depends on HAS_IOMEM
  358. depends on OF
  359. help
  360. Enable this option if you want to have support for thermal management
  361. controller present in Marvell EBU Armada SoCs (370,375,XP,38x,7K,8K).
  362. config DA9062_THERMAL
  363. tristate "DA9062/DA9061 Dialog Semiconductor thermal driver"
  364. depends on MFD_DA9062 || COMPILE_TEST
  365. depends on OF
  366. help
  367. Enable this for the Dialog Semiconductor thermal sensor driver.
  368. This will report PMIC junction over-temperature for one thermal trip
  369. zone.
  370. Compatible with the DA9062 and DA9061 PMICs.
  371. menu "Mediatek thermal drivers"
  372. depends on ARCH_MEDIATEK || COMPILE_TEST
  373. source "drivers/thermal/mediatek/Kconfig"
  374. endmenu
  375. config AMLOGIC_THERMAL
  376. tristate "Amlogic Thermal Support"
  377. default ARCH_MESON
  378. depends on OF && ARCH_MESON
  379. help
  380. If you say yes here you get support for Amlogic Thermal
  381. for G12 SoC Family.
  382. This driver can also be built as a module. If so, the module will
  383. be called amlogic_thermal.
  384. menu "Intel thermal drivers"
  385. depends on X86 || X86_INTEL_QUARK || COMPILE_TEST
  386. source "drivers/thermal/intel/Kconfig"
  387. endmenu
  388. menu "Broadcom thermal drivers"
  389. depends on ARCH_BCM || ARCH_BRCMSTB || ARCH_BCM2835 || ARCH_BCM_IPROC || \
  390. COMPILE_TEST
  391. source "drivers/thermal/broadcom/Kconfig"
  392. endmenu
  393. menu "Texas Instruments thermal drivers"
  394. depends on ARCH_HAS_BANDGAP || COMPILE_TEST
  395. depends on HAS_IOMEM
  396. source "drivers/thermal/ti-soc-thermal/Kconfig"
  397. endmenu
  398. menu "Samsung thermal drivers"
  399. depends on ARCH_EXYNOS || COMPILE_TEST
  400. source "drivers/thermal/samsung/Kconfig"
  401. endmenu
  402. menu "STMicroelectronics thermal drivers"
  403. depends on (ARCH_STI || ARCH_STM32) && THERMAL_OF
  404. source "drivers/thermal/st/Kconfig"
  405. endmenu
  406. source "drivers/thermal/renesas/Kconfig"
  407. source "drivers/thermal/tegra/Kconfig"
  408. config GENERIC_ADC_THERMAL
  409. tristate "Generic ADC based thermal sensor"
  410. depends on IIO
  411. help
  412. This enabled a thermal sysfs driver for the temperature sensor
  413. which is connected to the General Purpose ADC. The ADC channel
  414. is read via IIO framework and the channel information is provided
  415. to this driver. This driver reports the temperature by reading ADC
  416. channel and converts it to temperature based on lookup table.
  417. menu "Qualcomm thermal drivers"
  418. depends on (ARCH_QCOM && OF) || COMPILE_TEST
  419. source "drivers/thermal/qcom/Kconfig"
  420. endmenu
  421. config UNIPHIER_THERMAL
  422. tristate "Socionext UniPhier thermal driver"
  423. depends on ARCH_UNIPHIER || COMPILE_TEST
  424. depends on THERMAL_OF && MFD_SYSCON
  425. help
  426. Enable this to plug in UniPhier on-chip PVT thermal driver into the
  427. thermal framework. The driver supports CPU thermal zone temperature
  428. reporting and a couple of trip points.
  429. config SPRD_THERMAL
  430. tristate "Temperature sensor on Spreadtrum SoCs"
  431. depends on ARCH_SPRD || COMPILE_TEST
  432. help
  433. Support for the Spreadtrum thermal sensor driver in the Linux thermal
  434. framework.
  435. config KHADAS_MCU_FAN_THERMAL
  436. tristate "Khadas MCU controller FAN cooling support"
  437. depends on OF
  438. depends on MFD_KHADAS_MCU
  439. select MFD_CORE
  440. select REGMAP
  441. help
  442. If you say yes here you get support for the FAN controlled
  443. by the Microcontroller found on the Khadas VIM boards.
  444. config LOONGSON2_THERMAL
  445. tristate "Loongson-2 SoC series thermal driver"
  446. depends on LOONGARCH || COMPILE_TEST
  447. depends on OF
  448. help
  449. Support for Thermal driver found on Loongson-2 SoC series platforms.
  450. The thermal driver realizes get_temp and set_trips function, which
  451. are used to obtain the temperature of the current node and set the
  452. temperature range to trigger the interrupt. When the input temperature
  453. is higher than the high temperature threshold or lower than the low
  454. temperature threshold, the interrupt will occur.
  455. endif